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Electronic Resin of Cyclic Olefin Copolymer (COC) is a high-performance thermoplastic resin engineered for electronic and optical applications, distinguished by its low dielectric constant (εᵣ ≈2.3–2.6 at 1 GHz), high light transmittance (>90% at 400–800 nm), and excellent thermal stability (Tg ≈70–180℃). Unlike traditional electronic resins (e.g., epoxy, polyimide), it offers superior electrical insulation, low water absorption (<0.01%), and compatibility with high-frequency signals—making it ideal for 5G PCBs, optical waveguides, and semiconductor packaging. With a purity of ≥99.9% (low metal impurities <1 ppm) and compliance with RoHS 2.0/REACH SVHC, it meets the strict requirements of electronic manufacturing. Its processability via injection molding, extrusion, and photolithography further expands its use in miniaturized electronic components—where performance and reliability are critical.
COC electronic resin exhibits an ultra-low dielectric constant (εᵣ) of 2.3–2.6 at 1 GHz and dielectric loss tangent (tanδ) of <0.001—far lower than epoxy resin (εᵣ≈4.0, tanδ≈0.02) and polyimide (εᵣ≈3.5, tanδ≈0.005). This low dielectric loss minimizes signal attenuation (≤0.1 dB/cm at 28 GHz) in high-frequency applications (5G, Wi-Fi 6E), ensuring reliable data transmission. For 5G PCB substrates, COC resin reduces signal delay by 30% vs. epoxy—enabling faster communication speeds (up to 10 Gbps). Its dielectric properties are also stable over a wide temperature range (-40℃ to 120℃), making it suitable for outdoor 5G base stations and automotive radar systems.
With light transmittance >90% at 400–800 nm (3mm thickness)—comparable to glass (92%)—COC electronic resin is ideal for optical electronic components. Unlike polycarbonate (PC, transmittance ≈88%) and polymethyl methacrylate (PMMA, transmittance ≈92% but low heat resistance), it retains transmittance (>88%) after 1,000 hours of UV aging (Xenon arc test, ISO 105-B02)—preventing yellowing. For optical waveguides in data centers, it enables efficient light signal transmission (loss <0.1 dB/m) and integration with electronic components (e.g., photonic ICs). It is also used in LED lenses for automotive headlights, providing uniform light distribution and heat resistance (Tg ≈120℃).
COC electronic resin has a glass transition temperature (Tg) of 70–180℃ (grade-dependent) and decomposition temperature >350℃—stable during electronic processing (e.g., PCB soldering at 260℃). High-Tg grades (Tg ≈180℃) retain mechanical properties (>80% tensile strength) at 150℃, suitable for under-the-hood automotive electronics (e.g., ADAS sensors). Its ultra-low water absorption (<0.01% at 23℃/85% RH for 24h) prevents hydrolysis and dielectric property degradation—critical for semiconductor packaging (e.g., chip carriers) and marine electronics. Unlike epoxy (water absorption ≈0.2%), it eliminates “popcorning” (package cracking) during soldering, reducing PCB scrap rates by 20%.
With a purity of ≥99.9% and metal impurities (Cu, Fe, Na, K) <1 ppm (ICP-MS), COC resin avoids electrical short circuits and signal interference in sensitive electronics (e.g., semiconductors, sensors). It is compatible with key electronic manufacturing processes:
• Injection molding: Low viscosity (≈1,000–3,000 mPa·s at 240℃) enables molding of thin-walled parts (0.1mm thickness) like PCB connectors.
• Extrusion: Produces uniform films (5–50 μm) for flexible electronics (e.g., wearable sensors).
• Photolithography: UV-curable COC grades enable patterning of microstructures (10 μm resolution) for optical waveguides.
It also adheres well to metals (e.g., copper, aluminum) and ceramics, with a peel strength of ≈5 N/mm (copper-COC interface)—ensuring reliable bonding in PCB substrates.
| Category | Specification | Details |
| Chemical Identifiers | CAS Number | 26007-43-4 (generic for COC copolymers) |
| Monomer Composition | Cyclic olefin (e.g., norbornene) + ethylene (molar ratio 50:50 to 80:20) | |
| Molecular Weight | 100,000–300,000 g/mol (GPC, polystyrene standard) | |
| Purity | ≥99.9% (gas chromatography, GC) | |
| Physical & Thermal Properties | Appearance | Colorless transparent pellet/resin (no haze, high clarity) |
| Dielectric Constant (εᵣ) | 2.3–2.6 at 1 GHz (ASTM D150) | |
| Dielectric Loss Tangent (tanδ) | <0.001 at 1 GHz (ASTM D150) | |
| Light Transmittance | >90% at 400–800 nm (3mm thickness, ASTM D1003) | |
| Glass Transition Temperature (Tg) | 70–180℃ (DSC, ASTM D3418) | |
| Decomposition Temperature | >350℃ (5% weight loss, TGA under N₂) | |
| Water Absorption | <0.01% (23℃/85% RH, 24h, ASTM D570) | |
| Tensile Strength | 40–60 MPa (ASTM D638) | |
| Metal Impurities | <1 ppm (Cu, Fe, Na, K; ICP-MS) | |
| Compliance & Processing | Eco-Compliance | RoHS 2.0 (2011/65/EU), REACH SVHC (not listed), FDA 21 CFR Part 177.2480 (food-contact grades) |
| Processing Temperature | 200–280℃ (injection molding/extrusion) | |
| Molding Shrinkage | 0.5–1.0% (ASTM D955) | |
| Recommended Additives | UV stabilizers (for outdoor applications), antioxidants (e.g., Irganox 1010) |
In data centers, COC resin is used to fabricate optical waveguides and photonic IC packaging. Optical waveguides (extruded COC films, 50 μm thickness) have a light loss of <0.1 dB/m at 1,310 nm—enabling integration with electronic ICs for “photonic-electronic co-packaging” (reducing data center energy consumption by 40%). Photonic IC packaging (injection-molded COC) provides hermetic sealing (water vapor transmission rate <0.001 g/m²·day) and thermal management, protecting sensitive photonic components (e.g., lasers, modulators) from environmental damage. Companies like Intel and Broadcom use COC resin for next-generation data center photonics.
Automotive electronics (e.g., ADAS sensors, radar systems, infotainment PCBs) use COC resin for its thermal stability and low dielectric loss. ADAS sensor housings (high-Tg COC, Tg≈150℃) withstand under-the-hood temperatures (up to 120℃) and retain dielectric properties (εᵣ≈2.5 at 77 GHz)—ensuring reliable radar detection (range accuracy ±0.1 m) for autonomous driving. Infotainment PCBs (COC-epoxy composites) have a dielectric loss of <0.002 at 5 GHz—supporting high-definition video streaming (4K) and 5G connectivity in vehicles. Automotive suppliers (e.g., Bosch, Continental) use COC resin to meet strict automotive standards (ISO 16750, AEC-Q200).
COC resin is used in semiconductor chip carriers and wearable sensor enclosures. Chip carriers (injection-molded COC, Tg≈180℃) have low water absorption (<0.01%)—preventing “popcorning” during soldering and extending semiconductor lifespan (10+ years). Wearable sensor enclosures (flexible COC films, 10 μm thickness) are biocompatible (ISO 10993-1) and transparent—enabling integration with optical sensors (e.g., heart rate monitors, blood oxygen sensors) for smartwatches and fitness trackers. Apple and Fitbit use COC resin for wearable sensor enclosures, leveraging its biocompatibility and durability.
COC has a low dielectric constant of 2.3–2.6 at 1 GHz, suitable for high-frequency electronics like 5G PCBs.
It has >90% light transmittance at 400–800 nm, comparable to glass with better impact resistance.
No, it has ultra-low water absorption (<0.01%), preventing dielectric degradation and hydrolysis.
Yes, its decomposition temperature >350℃ ensures stability during PCB soldering at 260℃.
